When the NiPdAu finish first came out, we had many TI components failing because the plating was peeling off of the basis metal on the gullwing component leads after they were soldered. The solder would "wet" to the leads just fine, but you did not have a good mechanical connection due to the plating not properly adhering to the leads themselves. Over the years, I have seen reliability issues with TI NiPdAu plating at different companies I worked for. It was often manifest as fractured leads, where the lead is actually still in the solder joint but fractured and separated from the solder fillet itself (sitting in the saddle, but no electrical connection). The solder joint was always well wetted to the board pad, but wherever it made contact with the lead it would be separated. You could see the thin flake of plating still in the solder joint, but the lead was a dark gray color where the plating broke off. I don't like soldering TI components. We tried several times to convince TI that their part plating was defective, including sending the parts to metallurgical labs for analysis where the plating issues were analyzed. TI did not return our calls, did not want to even discuss the problem. They just kept sending one "validation report" after another back to us. They told us our solder profile was incorrect. I don't like soldering TI components. I never did figure out what was wrong with the solder profiles at four different companies such that they were able to solder every single component on hundreds of different assembly types without any problems, yet only the TI parts with this particular finish had this issue. I don't like soldering TI components. If you look back on the TI threads in the archives, you will see that many others had the same issues with these parts with this finish. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of BADRI Sent: Wednesday, April 04, 2007 10:33 PM To: [log in to unmask] Subject: Re: [TN] NiPdAu FINISH Robert, We have assembled some boards with SnNipdAu component. The component was a QFP. We had heavy solderability issues on the reflow.The joint takes a bump formation. Hand soldering was not an issue. I have infact posted the same query last week in technet and the response was minimal. Thanx Badri -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon Sent: Thursday, April 05, 2007 3:02 AM To: [log in to unmask] Subject: [TN] NiPdAu FINISH Has anyone had an issue with TSSOP-xx pin packages (with NiPdAu lead finish) in the ability to solder using a normal SnPb solder both for SMT reflow and/or hand solder? 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