Werner, 2) Seppo K. Pienimaa et al, "Stacked Modular Package", IEEE Transactions on Advanced Packaging, Vol.27, No.3, August 2004, pp.461-466 1) This would be by my wife's friend Simin Bagheri of Celestica, not IBM. "Solder Joint Microstructure and Reliability Study of IBM Ceramic Ball Grid Array (CBGAs) Components", Simin Bagheri, Polina Snugovsky, Zohreh Bagheri, Marianne Romansky, Celestica, Toronto, Ontario, Matt Kelly, Marie Cole, Mario Interrante, Gregory Martin, Christian Bergeron, IBM, Markham, Ontario and New York, USA, Bromont, Quebec, in the Proceedings of the International Lead-free Conference, Toronto, 2006. Regards, Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier Sent: April 4, 2007 3:34 PM To: [log in to unmask] Subject: [TN] Reference info needed Hi 'Netters, Ineed the reference information for 2 papers: (1) Bagheri, S., et al, (IBM) "Solder Joint Microstructure and Reliability Study of Ceramic Ball Grid Array (CBGA) Components," ??? (2) Pienimaa, S., et al, (Nokia), "Stacked Modular Package," ??? Werner ************************************** See what's free at http://www.aol.com. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------