-----Original Message-----
From: Stadem, Richard D.
Sent: Monday, April 02, 2007 3:54 PM
To: [log in to unmask]
Subject: RE: [TN] IPC 6012 : Outgassing Criteria
Good input, Ms. Koo. However, I do not understand the part about the
component application engineer leaving. Surely the vendors use a
qualification process that does not change with personnel....?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, April 03, 2007 3:39 PM
To: [log in to unmask]
Subject: Re: [TN] IPC 6012 : Outgassing Criteria
if PCB outgas more (different from the qualified run), you might have
uncured laminate. The Tg and CTE may be off too. You may have cracked
PTH too... etc.etc.
Outgas product can deposite on your insertion connector, relay contact,
wire bonding pads, etc.etc. and cause your headach... If you reflow 2x
of your board, one side is better looking than the other (shining), you
might have outgas...(uncured mask)... you might have attract more ionics
and dust.. or attract more moistures.. Outgas usually are bad news... if
you qual properly, you should not see any problem...(provide the
vendors' application engineer stay with the company... if he changes
job, you may want to re-qual again).
jk (my 1.74 cents)
abcd
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Dehoyos, Ramon
Sent: Monday, April 02, 2007 4:23 PM
To: [log in to unmask]
Subject: Re: [TN] IPC 6012 : Outgassing Criteria
Wee Mei:
Out gassing is the decomposition of the material or the
evaporation of the material that can be a problem in an enclosed
environment such in submarines or outer space. The gasses can cool and
deposit in fiber optics or suffocate personnel. Even some pure metals
turn into gas at low pressures, outer space. Most materials provide gas
from their make up or outgas, some very little and a few none at all.
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lum Wee Mei
Sent: Wednesday, March 28, 2007 11:17 PM
To: [log in to unmask]
Subject: [TN] IPC 6012 : Outgassing Criteria
Hello,
I was reading this IPC 6012 when I come across Section 3.11.1 Outgassing
1. What actually is outgassing?
2. Why is outgassing critical for PCB?
3. As the PCB consist of so many processes and different materials go
into making it, where did the outgassing come from? 4. Is the criteria
mandatory for all Class PCB or only specified application?
5. If for only specific application, which application and why?
6. Come to think about it, can the outgassing come also from the coating
we use to seal the assembly?
Hope someone out there can share with me (novice) on this issue.
Thanks and regards,
Wee Mei
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