Hi Steve, Great! It looks really promising. Agree, nozzles are not my favorite either, they are unprecise, clumsy and you don't see what you are doing. It's also very interesting that you could handle such heavy BGAs, because many of our BGAs are real monsters. The heat transfer tape is also good idea. I will propose one of these, PDR or Sodifix. Thanks again. Inge PS. Still waiting for Mum's pie recipe. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: den 17 april 2007 22:50 To: [log in to unmask] Subject: Re: [TN] SV: [TN] SV: [TN] Tacking corners of BGAs Hi Inge! I've worked with a similar system while I was at LaBarge. We had a PDR Lightmaster Pro. The model is now known as a IR-X410. http://www.pdr.co.uk/Datasheets/PDRX410-IR-ReworkStation.pdf My own opinion of the station is that it was the best rework station I ever worked with. The IR heat to me seems very even and gentle. If you run across a BGA that is light colored or reflective (like many XILINX BGA's are), there's heat transfer tape that you apply to the part so that they can absorb the heat. The quartz bottomside preheaters also work really well. I've reworked a 1152-ball BGA that was mounted on a PCB that had a .055" thick copper core in the middle of it with no issues whatsoever. Another challenging rework task was when we had some radar modules that had the PCB's bonded down with conductive epoxy inside a thick, heavy, nickel plated aluminum chassis (little box actually) that needed some hybrids changed on them. Our hot air rework system (an OK Systems BGA-3000) couldn't even get the solder plastic. But the PDR system was able to remove the hybrids with ease. So it's not just for single layer boards. I really like not having to use nozzles, and I like being able to actually see the part while it's going through reflow instead of being covered-up by a nozzle. You can watch the BGA drop when it reaches good reflow temperature...when you're reflowing an eutectic BGA anyway. -Steve Gregory- -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord Sent: Tuesday, April 17, 2007 3:17 PM To: [log in to unmask] Subject: [TN] SV: [TN] SV: [TN] Tacking corners of BGAs When talking BGAs, has anyone tested the Sodiflux? Seems to be simple to use. The preheating/soldering by means of IR looks good. At least for single layer boards. Inge http://www.sodiflux.fr/fichier%20pdf/fritsch%20bga%20907.pdf -----Ursprungligt meddelande----- Från: TechNet [mailto:[log in to unmask]] För Hfjord Skickat: den 17 april 2007 19:39 Till: [log in to unmask] Ämne: [TN] SV: [TN] Tacking corners of BGAs Well then, Work as distances. Why didn’t you say that from the beginning. Like we use sometimes: we remove some corner balls and replace with somewhat higher temperature. I understand now. Thanks. Inge -----Ursprungligt meddelande----- Från: [log in to unmask] [mailto:[log in to unmask]] Skickat: den 17 april 2007 19:10 Till: [log in to unmask]; [log in to unmask] Ämne: Re: [TN] Tacking corners of BGAs Hi Ingemar, The corner epoxying serves not so much a mechanical fixation in the x/y-directions, but a way of preventing the solder balls from collapsing, and thus improving thermal cycling creep-fatigue reliability by (1) increasing h [with N h**2.2], and (2) improving the solder joint shape from squashed collapsed spherical to near-hour-glass. I also rather doubt that the 4 epoxy corners would be anywhere near strong enough to prevent the warping of superBGAs that thermally asymmetrically designed. Regards, Werner Engelmaier 可靠性先生 Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 386-437-8747, Cell: 386-316-5904 E-mail: [log in to unmask], Website: www.engelmaier.com ************************************** See what's free at http://www.aol.com. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------