Werner In the US Polymer Ball are being marketed by Kyocera. It is a ball made from a Japanese supplied polymer that is first plated with copper, and then the solder of you choice. Kyocera is marketing them as an alternative to using solid 90/10 balls on a ceramic BGAs. Around a failure probability of 62% they claim a 2X based on test data compared to a solid 90/10 ball on a ceramic BGA of moderate size. But if you go to failure probabilities of 1 - .1 % the Wiebull plots cross over showing similar fatigue lives. Give me a call for more details. Scott Newland Harris GCSD 321 768 4272 (W) 321 720 1756 (C) E-Mail [log in to unmask] This information is only intended for the use of the individual or entity named in this email. If you are not the intended recipient, you are hereby notified that any disclosure, copying, distribution, or use of the contents of this information is strictly prohibited. If you have received this email in error, please notify me and delete it immediately. -----Original Message----- From: Werner Engelmaier [mailto:[log in to unmask]] Sent: Wednesday, March 07, 2007 8:11 PM Subject: Re: [LF] Polymer Core BGA Balls It may be rhyme time...long before Wednesday, but........I still need technical information on polymer-core BGA balls. Werner ************************************** AOL now offers free email to everyone. Find out more about what's free from AOL at http://www.aol.com. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------