Ryan, Ramon is talking about filling via-in-pad, not vias that go all the way through the assembly. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ryan Grant Sent: Friday, March 02, 2007 4:18 PM To: [log in to unmask] Subject: Re: [TN] Via in Pad question Ramon, What you describe is correct and is the same technique for paste in hole through hole soldering. HOWEVER, there is also the tendency for the solder paste to 'drip' out the bottom side. This isn't always a problem if filling the via with solder is the last surface mount soldering operation. But if you must print solder on the 'drip' side, the 'drip' will lift and/or dent the stencil; thus becoming a major issue. Thanks, Ryan -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon Sent: Wednesday, February 28, 2007 10:37 AM To: [log in to unmask] Subject: Re: [TN] Via in Pad question For incorrect designs, where the vias are open. Would a bare board, with sufficient paste on the VIP to fill the vias, reflow run help? Other issues may pop up, but the vias would be filled. Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Tuesday, February 27, 2007 1:44 PM To: [log in to unmask] Subject: Re: [TN] Via in Pad question You just described the correct way to do it. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Marsico, James Sent: Tuesday, February 27, 2007 12:14 PM To: [log in to unmask] Subject: Re: [TN] Via in Pad question We've been using vias in pads for over 20 years. The vias are filled with resin, then the filled via is metalized and copper plated along with the pad. The result is what appears to be a solid pad. Jim Marsico EDO Corporation Amityville: 631-630-5079 Bohemia: 631-218-7057 [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE) Sent: Tuesday, February 27, 2007 1:04 PM To: [log in to unmask] Subject: Re: [TN] Via in Pad question Avoid them if it's possible, if not have a good via protection process and communicate with your contract manufacturer. He needs to be aware of whether he has to deal with open holes or depressions so he can compensate with paste application. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Carl VanWormer Sent: Tuesday, February 27, 2007 9:58 AM To: [log in to unmask] Subject: [TN] Via in Pad question I am looking for guidance on using vias in pads of surface mount components. The concept is great for high speed design, since it gives the least inductance for mounting bypass caps. It sounds easy, but I'm sure there are some pitfalls and there may be some rules I will break. Any guidance towards documents on this combination would be appreciated. Also, any stories to scare me away from this approach will be fun to hear. Later, Carl Carl Van Wormer Cipher Systems 1800 NW 169th Place, Suite B-100 Beaverton, OR 97006 Phone (503)-617-7447 extension 20 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC 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