Please share the photos at your convenience, Paymon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier Sent: March 30, 2007 7:23 PM To: [log in to unmask] Subject: Re: [TN] Solder Resist Encroachment onto BGA pads Hi Paymon, It is not that the IPC does "not allow" it, but data have shown that the stress concentrations in the solder ball geometries resulting from SMD-[soldr mask defind] pads is about a factor of 2 to 3 less than well-shaped balls on pads not encroached by solder mask. I can show you some beautiful [to an engineer, anyway] pictures of the consequences. Werner ************************************** See what's free at http://www.aol.com. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------------------------------------------- Confidentiality Notice This e-mail and any attachment(s) are intended for the individual or entity to which this email is addressed and may contain information that is confidential. If you are not the intended recipient or an employee or agent responsible for delivering this e-mail to the intended recipient, please be aware that any dissemination, distribution or copying of this communication is strictly prohibited. If you have received this in error, please notify the sender by telephone at 604.430.4336 or by return e-mail, and please delete or destroy all copies of this communication. Thank you! --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------