Lead Free Selective Soldering - The Future is Now April 17, 2007 - Bannockburn, IL This IPC workshop will provide case histories and examples where selective soldering has been implemented. To complete your knowledge of the selective soldering process, it will also describe component limitations, clearance restrictions, and thermal requirements and solder joint reliability issues. Some of the topics that will be covered are: what selective soldering is, technology drivers, the benefits of selective soldering, selective soldering methods, and advantages and disadvantages of various methods. It will also review design guidelines, selecting the right system for an application, case histories, increasing role of selective soldering and future trends Bob Klenke is the workshop instructor. He is a mechanical engineer with over 25 years of experience in the electronics assembly industry, particularly in selective soldering. Bob is a principal consultant of ITM Consulting, an international consulting firm. Klenke is also president and founder of RHK Associates. To register for this workshop, please cut and paste www.ipc.org/LFS0407 into your browser and download the registration form. Lead Free SMT Manufacturing and Troubleshooting April 18, 2007 - Bannockburn, IL While other courses and workshops discuss aspects of lead free alloys, this course examines what lead free means to the electronic assembler at the process and logistics level. This course will give the participant an in-depth understanding of SMT assembly using lead free solder alloys. The various aspects of no-lead solder are examined, including why the drive for lead free electronic manufacturing, as well as which lead free alloys are being considered, and by whom. The pros and cons of candidate solder alloys are discussed and put into an applications-specific perspective. The second part of the course will contend with the implications of lead free on the SMT assembly process. Interactions with substrate finishes and components will be discussed as will the far-reaching implications and process adaptations that must be made to accommodate no-lead soldering. You will review the following: why lead is a concern in electronics, status of lead free in the world, lead free alloy directions, wave-solder alloys, impact of no lead on SMT assembly, OEM vs. CEM impacts, alternatives and enhancements to lead free electronic assembly and finally, casual mini-audit (review of current assembly facility, if applicable). This workshop instructor is Phil Zarrow, President and co-founder of ITM, Incorporated. He has been involved with hybrid and PCB assembly for more than 26 years, has chaired and instructed at numerous seminars and conferences and has been involved with setup and troubleshooting through-hole and SMT processes throughout the world. To register for this workshop, please cut and paste www.ipc.org/LFSMT0407 into your browser and download the registration form. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------