We have been transitioning our assemblies to a lead free process and doing so have changed our FAB material and solder finish to ENIG. I was going to request the PCB shops vacuum seal with desiccant and a moisture indicator using a see through ESD material. One of the main reasons is to prevent moisture absorption. We are a low volume high mix manufacturing facility. Some of our FAB's sit on the shelve for up to a 6-12 months. Board thickness varies from .063 to .145". We could bake the boards prior to assembly but this is a process I am trying to limit to specific boards that are high risk. My understanding baking boards also have risk and can cause the intermetallic layer to increase with ENIG boards. I've read this in several white papers and in seminars I've attended. Any suggestions on packaging methods or packaging materials for PCB's would be appreciated. Also what others are doing about baking PCB's and if it is a standard practice you are doing for all your boards. Thank you for your comments on this topic greatly appreciated! Scott Lefebvre --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------