Thanks for the prompt reply. I can do the gold calculations - lots of stuff on the tech-net telling me how to do that. We have not seen any solderability issues. I would still like an explanation of the reasoning behind the minimum nickel thickness( besides a keypad type application). Regards Steve Kelly> Steve, > > I will likely solder quite well, but the gold is quite thick for > soldering to without incurring the wrath of gold embrittlement. I would > not be so concerned about the thin nickel as the overabundance of gold. > > If the gold were nice and soft, it would be nice for gold ball bonding! > But, the nickel is quite thin. > > If the numbers are correct, you did not receive ENIG - have them sent > back > > Steve C > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask] > Sent: Wednesday, March 14, 2007 9:31 PM > To: [log in to unmask] > Subject: [TN] IPC ENIG SPECIFICATION > > Hi All, > I have a question about this specification. Obviously when the > technical > gurus wrote this they had good reasons for specifying the nickel at a > minimum of 118 microinches. One of our customers recently received some > parts from the far east. The print called for ENIG but the parts came in > with approx. 20 microinches of nickel and approx. 40 microinches of > gold. > My question is what are the reliability/solderability concerns on low > nickel. Thanks in advance. Regards Steve Kelly > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text > in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives > Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 > ext.2815 > ----------------------------------------------------- > > THE INFORMATION CONTAINED IN THIS E-MAIL MESSAGE AND ANY ATTACHMENTS SENT > FROM GENTEX CORPORATION IS GENTEX CONFIDENTIAL INFORMATION INTENDED ONLY > FOR THE PERSONAL USE OF THE INDIVIDUAL OR ENTITY NAMED ABOVE. If you are > not the intended recipient, you are hereby notified that any review, > distribution, or copying of this communication is strictly prohibited. If > you have received this communication in error, please immediately notify > the sender by return e-mail, and delete this e-mail message and any > attachments from your computer. > > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------