Our company requires change of manufacturer's catalog number , it will be a lot of work... ----- Original Message ----- From: "arnaud grivon" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, March 30, 2007 1:29 PM Subject: Re: [TN] Alternative SAC > Gabriela, > > I have exactly the same concern as you. > Low silver SAC alloy like SAC 105 or SAC 206 (with possible addition of > Ni) are promoted by some component manufacturers for devices typically > found in handheld applications. Be aware that these alloys have higher > melting temperatures close to the 232°C reflow temperature of pure tin. > Fortunately, it looks like this alloy family is only considered for small > packages (e.g. 0.8mm and 0.5mm pitch packages) which is a good point from > a thermal profiling point of view. > Very interested to follow that thread.... > Best regards, > > A. Grivon > > Gabriela Bogdan a écrit : >> Dear Technetters: >> Do you know if SnAg1Cu0.5 alloy is being used by BGA manufacturers >> instead of SAC 305? >> If so, what impact does it have on the mixed assembly solder profiles? >> We use a peak temperature of 232C on the lead free BGA top, for lead free >> BGA's on leaded solder paste on mixed assemblies. >> Is the information usually available on the data sheets? >> (Yesterday....) >> Gaby >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >> To unsubscribe, send a message to [log in to unmask] with following text in >> the BODY (NOT the subject field): SIGNOFF Technet >> To temporarily halt or (re-start) delivery of Technet send e-mail to >> [log in to unmask]: SET Technet NOMAIL or (MAIL) >> To receive ONE mailing per day of all the posts: send e-mail to >> [log in to unmask]: SET Technet Digest >> Search the archives of previous posts at: >> http://listserv.ipc.org/archives >> Please visit IPC web site >> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >> ext.2815 >> ----------------------------------------------------- >> > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------