Guy/Gals, Thanks for the solutions to the problem. I know how to fix it in the future. The question I am trying to answer does not have anything to do with how to fix the problem. The question is quite simply, if a vendor supplied boards with this condition, and it resulted in scrap/rework, would you consider that your liability or theirs? mk \Matt Kehoe SIPAD Systems Inc "The Original Solid Solder Deposit" 360-C Winkler Drive Alpharetta, GA. 30004 770-475-4576 770-475-1597 fax www.sipad.com [log in to unmask] Please note, Matt Kehoe's E-mail has changed from [log in to unmask] to [log in to unmask] This new email is heavily filtered for spam. If your email is bounced, forward the bounce back text to [log in to unmask] and your account will be unblocked. Thank you for your patience in helping SIPAD Systems combat spam. ----- Original Message ----- From: "Bill Kunkle" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, March 09, 2007 2:11 PM Subject: Re: [TN] Paste Volume, off contact vs non off contact > Matt, > > I agree with Bill C, stencil relief pockets at the via locations will > allow > the high points to be accepted into the bottom of the foil. > > Bill Kunkle > MET Assocs > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Matt Kehoe > Sent: Friday, March 09, 2007 12:01 PM > To: [log in to unmask] > Subject: [TN] Paste Volume, off contact vs non off contact > > > We have been processing a family of boards for 3 years. No issues. New PCB > Vendor and the boards suddenly will not print very well. Sloppy printing > definition. Heavy heavy deposition. > > Closer inspection reveals that the soldermask is built up .0012-.0019 over > the vias, preventing the stencil from gasketing. Vendor claims they are > built to print.. Opinions? > > Pictures at ; > http://www.sipad.com/ssiqa/3942vias.pdf > http://www.sipad.com/ViasBuildup.pdf > > The question we are trying to answer is, if your boards came in with mask > this thick over the vias would you feel confident in running them without > modifing the stencil? Would you expect a significant increase in solder > volume? > > > mk > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------