We have a customer that is experiencing delamination issues with the FR408 material they have specified for use on one of their circuit boards. They have recently gone RoHS compliant with Pb-free solders and the associated rise in reflow temperatures seems to have created this problem. Does anyone have any experience with mitigating this problem, or can you suggest a better PCB platform instead of FR408 for high frequency signal resolution/internal impedance control applications at higher reflow temperatures? Thanks, Dale Ritzen Quality Manager Austin Manufacturing Services --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------