I have seen a similar but not exactly the same type of problem with boards before, although it was more puzzling... because it was random and not repeatable from board to board... Different areas of the board were getting breaks in the lines near pads and even across pads... It turns out that the mask used to plate the tin resist before etching was breaking loose in the plating solution and re-depositing itself in random places on the board surface preventing tin plating on the copper and causing the traces or pads to not be fully protected by the tin during the etching process... leaving voids much like you show in the picture. Bill Brooks PCB Design Engineer, C.I.D.+ Tel: (760)597-1500 Fax: (760)597-1510 Datron World Communications, Inc. Vista, California -----Original Message----- From: Garry Foskett [mailto:[log in to unmask]] Sent: Tuesday, March 20, 2007 6:24 AM To: [log in to unmask] Subject: Re: [TN] Pad damage Jim, I would inspect the manufacturing files foe this feature on the pad. From the look of it this is not what was on the manufacturing data and thus an error from the supplier. The reason fro this thought is that the resist window looks to be the correct size and shape for a complete rectangular pad. Garry -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Jones, Evamaria Sent: 20 March 2007 14:11 To: [log in to unmask] Subject: Re: [TN] Pad damage Does it meet the drawing? If not it is a defect. Evamaria Jones Quality Assurance Specialist Electronic Manufacturing Skills Instructor General Dynamics Information Technology (703) 874-6796 direct (540) 522-8823 cell [log in to unmask] www.gdit.com <https://owandhm.gd-ns.com/exchweb/bin/redir.asp?URL=http://www.gdit.com/> ________________________________ From: TechNet on behalf of West, Jim Sent: Tue 3/20/2007 10:07 AM To: [log in to unmask] Subject: [TN] Pad damage Hi everyone, Take a look at the link http://stevezeva.homestead.com/files/Pad_Damaged.jpg <http://stevezeva.homestead.com/files/Pad_Damaged.jpg> Tell me what you think about the pad damage shown. I have not come across anything like this before, and was asked by our group leader if this was acceptable. My initial thought was this is not acceptable and we should reject the board. As always, I wanted to point out the IPC section that would explain why this is not good. However, I could not come across anything except for section 10.2.9 (Laminate conditions-conductors/lands). I know there is probably a section I am overlooking? There is still a high percentage of the pad intact and no evidence of lifting. Is this something common that others have seen? If so, what do I tell the board house to look out for to prevent something like this in the future? Would anyone accept this? Thanks, <http://stevezeva.homestead.com/files/Pad_Damaged.jpg> Jim West Engineering Manager Nexergy Inc. www.nexergy.com tel: (614) 351-6216 fax: (614) 324-1979 This email message and all attachments transmitted with it are intended solely for the use of the addressee(s) and may contain legally privileged, protected or confidential information. 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