小郝和小段:你们好.新春节快乐!
下面是我对术语修改的另一部分内容,仅供参考。
IPC-T-50G Part 1 of 12
术语修改4部分:



 

Azeotrope                                          共沸点混合物         

See "Azeotropic Mixture."

见“共沸点混合物”

▲共沸混合物――见“共沸混合物”

 

Azeotropic Mixture (Azeotrope)     共沸点混合物         49.1330

A liquid mixture of two or more substances that behaves like a single substance. The vapor produced by partial evaporization of the liquid has the same composition as the liquid.

两种或多种的混合液体，其性质类似于单一物质。 其粒子挥发所产生的蒸汽与液态成份相同。

▲共沸混合物----两种或多种物质的混合液体。其性质类似于单一物质， 其粒子挥发所产生的蒸汽与液态成份相同。

 

B-Stage                                              B阶               

An intermediate stage in the reaction of a thermosetting resin in which the material softens when heated and swells, but does not entirely fuse or dissolve when it is in contact with certain liquids. (See also "C-Staged Resin.")

热固性树脂反应的中间阶段，其当受热膨胀时材料软化,，但当与某种液体接触时并不完全融化或分解。 (另见”C阶树脂”)

▲热固性树脂反应的中间阶段，在该阶段的材料受热膨胀时会软化，但与某种液体接触时并不完全融化或溶解。

 

B-Staged Resin                                B级树脂          

A thermosetting resin that is in an intermediate state of cure. (See also "C-Staged Resin.")

处于固化中间的热固性树脂。(另见“C阶树脂”。)

▲处于固化中间状态的热固性树脂。

 

Back Annotation                                逆向注解         

The process of extracting appropriate information from a completed printed board design and inserting it on the board's schematic diagram.

从完成的印制板设计中提取适当的信息并将其插入到印制板原理图中的过程。

 

Back Bonding                                    背向键接         

Attaching a die to a base material with its circuitry facing away from the base material. (See Figure B-1.)

将晶片与基材连接，使其线路面与基材相背。

▲背面粘接---以芯片电路的背面与基材连接的方式将芯片贴到基材上。

 

Back Mounting                                  背向安装         74.0079

See "Back Bonding."

▲背面安装---见”背面粘接.”

 

Back Taper(s)                                   倒锥                 51.0081

The constant decrease in diameter along the length of the body of a drill.

直径沿钻头长度方向的持续缩小。

▲其直径沿钻头体的长度逐渐减小。

 

Back-Bared Land                              背裸焊盘         22.0071

A land in flexible printed wiring that has a portion of the side normally bonded to the base dielectric material exposed by a clearance hole. (See Figure B-2.) 

挠性印制线路中的连接盘，其与介质基材相连接的其中一面通过间隔孔暴露出来。(见图B-2.)

▲露背焊盘---挠性印制线路中的连接盘。通常与介电基材相粘结面上的挠性印制线路有一部分通过隔离孔暴露出来。    

 

Backfill                                               回填                 36.0075

Filling a hybrid circuit package with a dry inert gas prior to hermetic sealing.

▲充气---在气密封混合电路封装前用干燥惰性气体填充。 

Background (Artwork)                     底层(底片)              22.0076

The nonfunctional area of a phototool.

照相底图上非功能性区域.

▲背景图形(照相底图)--- 照相底片上的非功能性区域。

 

Backlighting                                      背光                 24.0078

Viewing or photographing by placing an object between a light source and the eye or recording medium.

将物体放置在光源与眼睛或记录装置间进行观察或拍照。

▲逆光---。

  
童晓明CESI