Looks like a White Castle advertisement. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Tuesday, February 27, 2007 12:26 PM To: [log in to unmask] Subject: Re: [TN] Via in Pad question Hi Carl! I've run across some via-in-pad designs that were a major pain. They were supposed to be filled and cap plated, then planarized, but this is what I got: http://www.stevezeva.homestead.com/files/Raised_Vias.jpg Fun stuff eh? That's when I took a board and did a very rough cross-section with my trusty dremel tool just to see what was going on and why the bumps were so big. http://www.stevezeva.homestead.com/files/Rough_Cross_Section.jpg http://www.stevezeva.homestead.com/files/Cross_Section.jpg I was somewhat able to compensate with solder paste...I think it was the first time in a L-O-O-O-N-G while I ordered a 10-mil thick stencil. Just hope that you don't get boards back like these if you decide to go that route. -Steve Gregory- -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Carl VanWormer Sent: Tuesday, February 27, 2007 10:58 AM To: [log in to unmask] Subject: [TN] Via in Pad question I am looking for guidance on using vias in pads of surface mount components. The concept is great for high speed design, since it gives the least inductance for mounting bypass caps. It sounds easy, but I'm sure there are some pitfalls and there may be some rules I will break. Any guidance towards documents on this combination would be appreciated. Also, any stories to scare me away from this approach will be fun to hear. Later, Carl Carl Van Wormer Cipher Systems 1800 NW 169th Place, Suite B-100 Beaverton, OR 97006 Phone (503)-617-7447 extension 20 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------