An ENIG PWB presents little in the way of packaging/storage requirements except safe handling issues. The gold prevents any oxidation. However, on a separate note, ENIG has some major solderability issues. You may wish to become educated in those. The best way to do so is to google the terms "dissolution rate of nickel into tin", "black pad", "brittle interfacial fracture" etc. There are a lot of good articles on that subject. Better yet, just google "Werner Engelmaier" and you will get all of the real information without any BS. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Upton, Shawn Sent: Thursday, February 22, 2007 11:45 AM To: [log in to unmask] Subject: Re: [TN] Immersion silver handling What about gold imersion? A board assembly house indicated they prefered gold over silver. Is gold easier to handle? Shawn Upton, KB1CKT Test Engineer Allegro MicroSystems, Inc [log in to unmask] 603.626.2429/fax: 603.641.5336 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Thursday, February 22, 2007 12:10 PM To: [log in to unmask] Subject: Re: [TN] Immersion silver handling Do not delay between assembling the front and back of the board. Wear gloves when handling Do not open until ready to use them and make sure the vendor supplies them with silver saver interleave paper Be very careful on washing off mis-printed boards not to contaminate or degrade the surface. Just a few thoughts I am sure others will have more. John --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------