IPC/JEDEC announce the Lead Free Reliability and Reliability Testing for RoHS Lead Free Electronics conference, being held April 10-12, 2007 at the Courtyard Boston Tremont Hotel. This is your opportunity to further your knowledge on what is at THE FOREFRONT of electronics! This conference was designed to specifically address the challenges of reliability and reliability testing for lead free electronics. Among the leading reliability experts presenting at the technical conference will be: Dr. David Pierce from Stanford University; Rainer Dudek, Fraunhofer Institute IZM; Lunyu Ma, Intel Corporation; Robert Kinyanjui, Sanmina-SCI Corporation; Isabel de Sousa, IBM Canada and Wolfgang Biben, CenPra-Centro de Pesquisas Renato Archer. Following the technical conference, we are also offering educational courses on April 12, to provide in-depth information on the following topics: lead free solder process, specifying PCBs for lead free assembly, lead free reliability for harsh environment electronics and understanding of the J-STD-020B and J-STD-033A documents. To register, please cut and paste the following into your browser: www.ipc.org/LFReliability and download the registration form. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------