Correct once again, Steve. Per par. 3.9.3 of Rev D, you must either remove the gold ON COMPONENT LEADS via tinning or you must perform qualification testing and present it for approval to prove a gold embrittlement issue does not exist with "documented objective evidence". That is a time-variable qualification. You cannot just hang a 5-lb weight on a wire and solder the other end to the component lead and say "it didn't break, so it must be OK". ENIG finishes on circuit boards or substrates are exempt from this. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Wednesday, January 31, 2007 2:34 PM To: [log in to unmask] Subject: Re: [TN] Maximum Au lead plating thickness Doesn't J-STD-001 say that you can't solder to SMT components with gold plating no matter what the thickness, and to PTH components unless the plating is less than 2.5 micro-meters without removing the gold? -Steve Gregory- -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis, Edwin @ CSE Sent: Wednesday, January 31, 2007 2:26 PM To: [log in to unmask] Subject: Re: [TN] Maximum Au lead plating thickness Ron Bulwith at Alpha Metals(Cookson in Jersey City) researched this and found that allowable Gold thickness you can solder to with a Tin solder is ~15-20 micro-inches.You can solder to Gold up to ~200 micro-inches thick with Lead-Indium solder. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian Sent: Wednesday, January 31, 2007 2:32 PM To: [log in to unmask] Subject: Re: [TN] Maximum Au lead plating thickness Karen, You won't find it because it does not exist. You want less than 4% by weight in the final joint for sure. Dr. Cotts of SUNY Binghampton would argue for much less. The reason you won't find a lead plating limit is that the results will depend on: 1) lead size 2) pad size 3) stencil thickness These will all affect the final joint concentration. Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Walters Ebner Sent: Wednesday, January 31, 2007 2:01 PM To: [log in to unmask] Subject: [TN] Maximum Au lead plating thickness Hi We are looking for the IPC spec that calls out the maximum Au plating thickness on leads in order to prevent Au embrittlement. Can anyone provide this to me. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. 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