One rule of thumb that I used over the years was when soldering eutectic solder (Sn 63 Pb 37) on ENIG board finishes to run the profile a bit hotter than HASL. Instead of say 205 C I remember literature citing 217 C as the minimium temperature with the rationale being that nickel diffusion rates into solder are much slower than copper. I did several internet searches for some supporting literature and couldn't readily find any. Any ideas where I could find some supporting evidence and/or literature? Thanks Tom Gervascio --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------