We have used these the last 10 years with success: http://www.epotek.com/SSCDocs/datasheets/H20E-175.PDF http://www.epotek.com/SSCDocs/datasheets/H35-175MP.PDF http://www.emersoncuming.com/other/84-1lminb.pdf There are lots of others, depends on other parameters than just stencil printability, For example what Tg you need, what minimum dot size is required, epoxy bleeding tendency, And so on. There is probably no universal adhesive that suits all. Inge -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski Sent: den 18 januari 2007 15:57 To: [log in to unmask] Subject: [TN] Chip Bonding Looking for a recommendation for a single part, stencil printable, chip bonding adhesive. I won't be using it on flip chips, but on a whole slew of your other typical SM components. Would appreciate your thoughts on products that I should consider. Rich K GTS --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------