I don't disagree with that at all. -----Original Message----- From: Wenger, George M. [mailto:[log in to unmask]] Sent: Monday, January 15, 2007 8:07 AM To: TechNet E-Mail Forum; Stadem, Richard D. Subject: RE: [TN] SMD Capacitor Shear Strength Richard, I agree with much of your data an observations but I need to side with Werner on your one statement. Neither peel strength nor shear strength are a relevant measure of solder joint reliability. They may give you measure of the strength of the solder joint at the moment when they were tested but they are not a relevant measure of solder joint reliability. If anything the mode of failure rather than the solder joint strength might give you some indication that you could possibly have a reliability issue. Regards, George George M. Wenger Senior Principle FMA / Reliability Engineer Wireless network Solutions Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Monday, January 15, 2007 8:54 AM To: [log in to unmask] Subject: Re: [TN] SMD Capacitor Shear Strength From data that I collected when performing solder paste evaluations for standard 63/37 solder (four different evaluations, four different companies, using only the data from the solder paste champions): For an 0603 soldered to immersion silver finish, the shear forces typically seen for an optimized solder joint are about 2100 grams as measured using a Dage shear tester. For ENIG this drops to around 1800 grams. You will normally see a range of about 1900 to 2400 grams for immersion silver finish. For ENIG the range drops to 1200 to 2100 grams and the variance from the mean is wider. When measuring sheer strength with the immersion silver finish, nearly all of the solder joints literally sheared through or tore the pads off of the boards (about 25% of the pads would release from the board before the solder joint finished shearing through). For 0603s mounted on ENIG, more than 70% of the solder joints fractured (broke off) before the solder joint sheared through, and less than 2% of the pads sheared off. The time required to shear through to release for the IAg solder joints averaged about 2.3 seconds, whilst the ENIG joints typically fractured at about 1.8 seconds, on average. This data was taken from 28 production board solder test coupons (7 each of 4 different assembly numbers from two board vendors) where solder balls were populated on the BGA pads, and 0402 caps, 0603 resistors, and 0806 resistors were populated but only one end was soldered to the pads. The difference in force/time required to shear 0402s and 0603s was very similar, significantly more was required to shear the 0806 packages. The force required to shear off the component is NOT doubled when both ends are soldered, but I am not sure why. Some of the 0402 caps did not have kapton tape covering one pad, so both ends were soldered. The Dage shear strength required to shear them off was about 2100 to 3000 grams. So I would suspect that for an 0603 component with both ends soldered to IAg you should see a minimum of about 2200 grams, on average. Peel strength is a more relevant measure of solder joint reliability than shear strength in terms of reliability. I have not found a way to easily perform peel strength on small components. The shear data does provide a pretty good indicator of solder joint IMF brittleness. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Todd, Richard Sent: Thursday, January 11, 2007 5:04 PM To: [log in to unmask] Subject: [TN] SMD Capacitor Shear Strength I have a question for the oracle . . . Does anyone know what is the solder joint shear strength for an 0603 capacitor (assuming standard eutectic solder)? Regards, Rick Todd Senior Engineer Process Quality Engineering Panasonic Automotive Systems Company of America Division of Panasonic Corporation of North America 776 Highway 74 South, Peachtree City, GA 30269 770-515-1087 Direct 678-458-2887 Cell 770-486-2248 Fax [log in to unmask] <mailto:[log in to unmask]> --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ------------------------------------------------------------------------ ------------------------ This message is for the designated recipient only and may contain privileged, proprietary, or otherwise private information. 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