Hello Fellow techs, One of our CMs is having great difficulty developing a thermal profile for a small, double sided, densely populated board with different sized BGAs on one side. One of the BGAs is rather large and higher in thermal mass than the surrounding smaller BGAs. The issue is that when he gets the solder ball temperature of the larger BGA up to at least 205 C, the peak body temperature of 2 adjacent but much smaller and thinner BGAs exceeds their manufacturer's recommended peak body temperature of only 220 C by ~ 10 C. The CM does not think he can make any more adjustments to the 9-heating zone Heller oven to accomplish this task. Does anyone have any suggestions/ideas on how to heat the larger BGA sufficiently without over heating the smaller adjacent BGA components?. Possibly, he can insulate the smaller BGAs with a piece(s) of tape on the top (prior to assembly) to lower the body temperature - has anyone tried this? Look forward to reading anyone's idea. thanks Joe --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------