Hi All Thank you for your responses. This has been very helpful. Thanks again! "Sauer, Steve (Xetron)" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 01/31/2007 03:53 PM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Sauer, Steve (Xetron)" <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Maximum Au lead plating thickness Steve, I know, long time no hear, too busy keeping the bears off my arse! The standard states that "the gold shall be removed from 95% of all surfaces of surface mount components to be soldered regardless of thickness." BUT in the same paragraph (3.9.3 of rev D) the following is stated "These requirements may be eliminated if there is documented objective evidence available for review that there are no gold related solder embrittlement problems associated with the soldering process being used." So, the objective evidence would be the calculated percentage of gold in the solder connection. A sticky situation to be agreed upon with the customer. Steve Steve Sauer, CEPM Sr. Manufacturing Engineer Northrop Grumman Xetron Cincinnati, OH 513-881-3368 [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Wednesday, January 31, 2007 3:34 PM To: [log in to unmask] Subject: Re: [TN] Maximum Au lead plating thickness Doesn't J-STD-001 say that you can't solder to SMT components with gold plating no matter what the thickness, and to PTH components unless the plating is less than 2.5 micro-meters without removing the gold? -Steve Gregory- -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis, Edwin @ CSE Sent: Wednesday, January 31, 2007 2:26 PM To: [log in to unmask] Subject: Re: [TN] Maximum Au lead plating thickness Ron Bulwith at Alpha Metals(Cookson in Jersey City) researched this and found that allowable Gold thickness you can solder to with a Tin solder is ~15-20 micro-inches.You can solder to Gold up to ~200 micro-inches thick with Lead-Indium solder. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian Sent: Wednesday, January 31, 2007 2:32 PM To: [log in to unmask] Subject: Re: [TN] Maximum Au lead plating thickness Karen, You won't find it because it does not exist. You want less than 4% by weight in the final joint for sure. Dr. Cotts of SUNY Binghampton would argue for much less. The reason you won't find a lead plating limit is that the results will depend on: 1) lead size 2) pad size 3) stencil thickness These will all affect the final joint concentration. Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Walters Ebner Sent: Wednesday, January 31, 2007 2:01 PM To: [log in to unmask] Subject: [TN] Maximum Au lead plating thickness Hi We are looking for the IPC spec that calls out the maximum Au plating thickness on leads in order to prevent Au embrittlement. Can anyone provide this to me. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------