I have a question for the "Adhesive Dispense" OR the "0508 chip" experts out in Technet land. We at times struggle with 0508 capacitors tombstoning (yes, 0508 not 0805). We do run Nitrogen and turning it off helps at times but there are many times we need to run nitrogen for other reasons. Most times we try to dispense a dot of adhesive (Loctite 3609) but we are having occasional issues with the adhesive getting into the solderpaste, the gap between the pads measures ONLY 0.020" so it is difficult to prevent this from happening. Does anyone out there run into the same issues?? Any thoughts?? We run a Camalot Gemini and a Fuji GL dispenser and use a 25 GA needle. Also we use Indium SMQ92J No Clean solderpaste so I don't know if this paste is contributing to the tombstoning. A re-layout of the boards is not an option. We have tried both a "straight ramp" and a "ramp-soak-ramp" profile with little or no difference. Thanks for your thoughts and advice Royce ************************************************* Royce Taylor Raytheon 350 Lowell St. Andover, MA 01810 (978) 470-7431 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------