Leslie Gomez and I were discussing standards and Cad library symbols and footprints and this subject came up... The question has been asked... is there a 'standard' naming convention for the large thermal pads used on the underside of chips like the QFN package? Some have called it a 'belly pad' others have called it a 'paddle pin'... some call it a 'die pad'. What do you call it and has anyone coined a 'standard name' for it? (Inquiring minds want to know...) :-) Reference: http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf <http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf> Best regards, Bill Brooks - KG6VVP PCB Design Engineer, C.I.D.+, C.I.I. DATRON World Communications, Inc. 3030 Enterprise Court, Vista, CA 92083 http://www.dtwc.com Tel: (760)597-1500 Fax: (760)597-1510 e-mail:[log in to unmask] IPC Designers Council, San Diego Chapter http://dcchapters.ipc.org/SanDiego/ Personal Website: http://pcbwizards.com --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To temporarily stop/(restart) delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL/(MAIL) Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ---------------------------------------------------------------------------------