Hi Gaby, do you have any experience? Dr' Jenny Hwang is favor for such idea, during the seminar. The thickness of the coating on PCB with the solder paste volume, will reduce the % of the Bismuth to acceptable level. Best Regards Reuven ROKAH -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gabriela Bogdan Sent: Tuesday, December 12, 2006 5:51 PM To: [log in to unmask] Subject: Re: [TN] 58Bi/42Sn /// HASL for PCBs Well, if you want to play an "Uri Geller" trick to your customers, maybe it is a good idea... Here they are soldered- and now: Abrakadabra- they all fall off just by my magic touch! Gaby http://www.mse.uiuc.edu/faculty/Shang/Preprints/1997-2006/ScriptaBi.pdf http://www.mrs.org/s_mrs/bin.asp?CID=2274&DID=48689&DOC=FILE.PDF ----- Original Message ----- From: "Reuven Rokah" <[log in to unmask]> To: <[log in to unmask]> Sent: Tuesday, December 12, 2006 9:54 AM Subject: Re: [TN] 58Bi/42Sn /// HASL for PCBs > I think its can be good alloy for PCBs HASL plating. > > If someone against, pls explain why not. > > Best Regards > Reuven ROKAH > e mail: [log in to unmask] > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman > Sent: Tuesday, December 12, 2006 1:34 AM > To: [log in to unmask] > Subject: Re: [TN] 58Bi/42Sn > > Hi Kerry - Dr. Hwang's book titled "Environment Friendly Electronics: > Lead-free Technology", ISBN 0-901150-40-1, Chapter 6.2, contains a > significant amount of data on the 58Bi/42Sn solder alloy which may be > helpful in your efforts. Good Luck. > > Dave Hillman > Rockwell Collins > [log in to unmask] > > > > > Kerry McMullen > <Kerry_McMullen@L > TX.COM> > To > Sent by: TechNet [log in to unmask] > <[log in to unmask]> > cc > > > Subject > 12/11/2006 09:01 [TN] 58Bi/42Sn > AM > > > Please respond to > TechNet E-Mail > Forum > <[log in to unmask]> > ; Please respond > to > Kerry_McMullen@LT > X.COM > > > > > > > Hello esteemed Technet, > I am looking comments on what you would consider the advantages > and > disadvantages of this composition of this solder paste. (58Bi/42Sn) > Lower MP. 138 Degrees C. > Lower fatigue resistance > Wetting to ImAg?? > Wetting to ImNiAu?? > No Clean? Residue? > Intermetallic Formation? > Mixing with 63/37Sn? > Our application is an RF board where we would use this paste post Wave / > Hand Solder. > Any comments appreciated. > > Cheers, > Kerry > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text > in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives > Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] > or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text > in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives > Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 > ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------