Hi, Looking for some help with the package shown within this email. The package virtually sits flush with the PCB, and the pads are directly under the body of the part. The pads are exposed on the side, but by a very small amount. I have a lot of questions regarding the processes from the beginning to the end, but wanted to see if anyone else runs this type of package and what your experiences have been like? Some questions would be stencil apertures design guideline, paste height, after reflow inspection method, and reworking. Best Regards, Jim West Engineering Manager Nexergy Inc. www.nexergy.com tel: (614) 351-6216 fax: (614) 324-1979 This email message and all attachments transmitted with it are intended solely for the use of the addressee(s) and may contain legally privileged, protected or confidential information. If you believe that you have received this message in error, please notify the sender immediately by email reply and please delete this message from your computer and destroy any copies. -------------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------