Hi Pradeep,
What your suggestions drive at is an additional test procedure sometimes 
referred to as "cyclic time-to-delamination to prove the capability of the PCB 
base material to survive the lead-free assembly process.
In my White Paper on specifying PCBs for lead-free assembly, I suggest that "
cT288" consisting of 6 thermal cycles to 288°C [3 for reflow simulation + 3 
for rework/repair simulation] as a requirement to be included in the PCB 'FAB 
Notes', particularly for h0rel PCBs.


Werner

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