Do not know if I would completely agree with Joyce. We have ASM, Datacom and Siemens's( Formally F&K ), and all seem to have there pros and cons. The pricieest seems to give us the most problems and not sure if it was worth it.one >From: Joyce Koo <[log in to unmask]> >Reply-To: [log in to unmask] >To: [log in to unmask] >Subject: Re: [TN] Die Bonder Recommendation >Date: Thu, 30 Nov 2006 17:29:16 -0500 > >ASM is a good one for the price. K&S recently got into the market. both >of >them are wire bonding equipment vendors, know very well how critical is the >die attach requirements...Normally, the more you pay, the better...;-) > >abcd > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]]On Behalf Of Syed Ahmad >Sent: Thursday, November 30, 2006 5:08 PM >To: [log in to unmask] >Subject: [TN] Die Bonder Recommendation > > >Would someone have a recommendation for a manual or semiauto die bonder? >Thanks. >Syed. > >Syed Sajid Ahmad >Center for Nanoscale Science and Engineering >North Dakota State University Fargo ND >701 231 5880 > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-615-7100 ext.2815 >----------------------------------------------------- _________________________________________________________________ Get the latest Windows Live Messenger 8.1 Beta version. Join now. http://ideas.live.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------