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From:  Charlotte Hao <[log in to unmask]>
Reply-To:  Asia Committe Task Group Forum <[log in to unmask]>, Charlotte Hao <[log in to unmask]>
To:  [log in to unmask]
Subject:  [TGA] Today's unsure terms for you to review(1218)
Date:  Mon, 18 Dec 2006 01:57:16 -0600
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>Dear all,
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>Today's unsure terms is coming. Please give us your hand. Thank you a lot!    :-)
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>5   Fabrication Process for Interconnection Structures       互连结构制造工艺
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>52  Imaging and Application of Resists and Inks        抗蚀剂和油墨的成像与应用
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>Laser Direct Imaging (LDI) Method 激光直接成像（LDI）法      52.1895
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>The selective exposure of patterns onto a photosensitive material (such as dry film or liquid) without using a working phototool (artwork master).
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>不使用底片（底图）而选择暴露感光材料（如干膜或液体）上的图形。
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>54  Material Removal Processes, Including Etchin          包括蚀刻的材料除去过程
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>Abrasive Trimming                               磨蚀调整                    54.1318
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>Adjusting the value of a film component by notching it with a finely-adjusted stream of an abrasive material against the resistor surface.
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>在电阻表面, 用微调研磨材料流量开槽的方法改变薄膜元件的值。
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>55  Lamination, Sequential Deposition, and Moulding Processes      层压、顺序沉积及模制加工
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>Layer-to-Layer Registration             层间重合度                   55.1899
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>The process of aligning circuit features (lands) on individual layers of a printed board through the use of tooling image location features (fiducials) or tooling holes.
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>通过使用定位图象位置特征（基准）或定位孔对准印制板各层的电路特征（连接盘）的过程。
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>56  Thermal Cure/Firing Processes                             热固化/烘烤加工
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>Co-Firing                                            共烧                               56.0219
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>The simultaneous processing of thick-film circuit elements during one firing cycle.
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>在一次焙烧周期中对厚膜电路元件的同时处理。
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>Heat of Fusion                                   熔化热量                       56.0593
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>The quantity of heat required to convert a unit weight of solid material to its liquid state.
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>将一个单位重量的固态材料转变为液态所需要的热量。
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>6   Types and Performance of Interconnection Structures for Electronic Packaging  电子封装互连结构及性能
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>64  Discrete Wiring Boards(Organic Substrates)                                   散线印制板（有机基板）
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>Bounce Pad (Discrete Wiring)            回弹垫片（分立布线）   64.1588
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>  An isolated area in a copper plane which acts solely as a stop for the laser drilling operation.
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>铜面上一个只用来停止激光钻孔操作的孤立区域。
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>Charlotte  郝宇
>技术助理
>Specialist Technical Program
>IPC WOFE, a subsidiary of IPC, Inc.
>爱比西国际科技管理咨询(上海)有限公司
>上海市宜山路711号
>Tel: 021-54973435
>Fax: 021-54973437
>邮编：200233