>Entry/Backup Material           引入/支持材料  盖板/垫板（材料）                51.1720
>
>A material which when placed on the top (entry) and/or bottom (backup) of a stack of printed boards being drilled or routed, supports the edges of drilled holes or routed profile such that the presence of burrs is minimized.
>
>在钻孔或布板时，放置于一叠印制板的顶部（引入）和/或底部（支持），支撑钻孔边缘或切板侧面，以便将毛刺减少到最低的材料。
钻孔或外形加工时，放在印制板的顶部（盖板）和/或底部（垫板）用于支撑钻孔和外形边沿的材料，其目的是为了减少毛刺产生。

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From:  Charlotte Hao <[log in to unmask]>
Reply-To:  Asia Committe Task Group Forum <[log in to unmask]>, Charlotte Hao <[log in to unmask]>
To:  [log in to unmask]
Subject:  [TGA] Today's unsure terms for you to review
Date:  Wed, 13 Dec 2006 21:16:03 -0600
>Dear all,
>
>From today, We'll send the rest of unsure terms  of IPC-T-50 after DUANGUAN Reviewing Meeting to TGASIA, for you to review.
>
>Thank you so much.
>
>We'll send 6 unsure  terms each day. The following terms are of today.  The green colored words are the categoris  in which the terms is.
>
>
>44  Reinforcement/Constraining Core/Heat Dissipation Material 增强材料/夹芯/散热材料
>
>
>
>Creel                                                   经轴架                           44.0315
>
>A device used as a yarn package rack to hold warp ends for a section beam.
>
>为分条整经轴固定经线端的一种纱线架装置。
>
>
>
>Treater Dirt (Base Materials)          处理器废物（基材)44.2103
>
>An inclusion which appears to be or is confirmed by analysis to be a type of resin particle which has been caught within the structure of the impregnation treater, to be picked up by a subsequent use of the treater; usually in some form of carbonization due to excessive exposure to the treater's heat.
>
>似乎是或经分析确认是树脂粒子外来夹杂物，在后续使用处理器时被夹裹在浸渍的处理器结构内，由于过度暴露于处理器的热量下通常以碳化物的形式存在。
>
>
>
>Knot (Base Materials)                      结(基材)                        44.1887
>
>A clump of reinforcement material formed either by the yarn within the web of the fabric or which was deposited onto the web during the treating process.
>
>在处理过程中，由织物网内纱线或网上纱线堆积形成的一团增强材料。
>
>
>
>45  Conductive Materials (Foil, Film or Plating)                       导电材料（箔、膜或镀层）
>
>
>
>As-Fired                                             共火                               45.0054
>
>The condition (values) of thick-film components or the smoothness of ceramic base materials, after they have been processed in a firing furnace and prior to trimming or polishing.
>
>切削或抛光前在热熔炉中处理的厚膜元件或陶瓷基材的平滑度的状况(数值)。
>
>
>
>46  Component Attaching Material (Conductive/Non-Conductive)   元件固定材料（导电/非导电）
>
>
>
>Creep Resistant Holding Power (Pressure Sensitive Tape) 抗蠕变保持力（压力敏感胶带）46.1869
>
>The ability of a pressure sensitive adhesive tape to resist static forces of shear applied to the same plane as the backing.
>
>压敏胶带具有抵抗作用于同一个支撑面的静态剪切力的能力。
>
>
>
>5   Fabrication Process for Interconnection Structures 互连结构制造工艺
>
>
>
>51  Mechnical Processes                                                     机械加工
>
>
>
>Helix Angle                                        螺旋角                           51.0601
>
>The angle of the spiral generated by the flute of a drill with respect to the axis of the drill.
>
>钻头排屑槽相对于钻头轴向形成的螺旋角。
>
>
>
>
>
>Charlotte  郝宇
>
>技术助理
>Specialist Technical Program
>IPC WOFE, a subsidiary of IPC, Inc.
>爱比西国际科技管理咨询(上海)有限公司
>上海市宜山路711号
>Tel: 021-54973435
>Fax: 021-54973437
>邮编：200233
>
>
>________________________________
>
>From: Charlotte Hao
>Sent: 2006-11-27 (星期一) 8:07
>To: [log in to unmask]
>Subject: Batch 1 terms on 27th,Nov.
>
>
>
>
>Dear All,
>
>
>These are 7 terms which are uncertain this afternoon,  please give us your opinions.  : )
>
>Thanks and regards
>
>
>Charlotte
>
>
>
>Drill Bit                                              钻头                              51.1702
>
>A rod with spiral flutes (grooves) and an obtuse angled point with sharpened cutting edges used to make holes by rotary action.
>
>一种带有螺旋凹槽的杆，头部为带有刃口的钝角尖，通过旋转运动制作孔。
>
>
>
>Dry Glass (Clad Laminate)           干玻（覆箔层压板）       41.1706
>
>A general reference to the appearance of a laminate where the reinforcement is highly visible, due to low/lost resin content or poor wetting/encapsulation of the resin to the reinforcement, although the resin coverage is acceptable.
>
>一种层压板外观的常规参照，其中，由于树脂含量低/损失或树脂对增强材料的润湿/密封不良，使得增强材料非常明显，尽管树脂覆盖率是可接受的。
>
>
>
>Embedded Fiber (Base Materials)      埋纤（基材）          44.1825
>
>An inclusion which has an insignificant width or diameter but has significant length, usually but not always in a curly or twisted configuration, generally from organic sources such as clothing or packaging materials.
>
>一种宽度或直径可忽略、但长度较明显的夹杂物，通常为但不总是弯曲或扭曲外形，一般源于有机物，如布料或包装材料。
>
>
>
>Equilibrium Wetting                       平衡润湿法          75.1722
>
>The degree of wetting in which the forces of wetting are in equilibrium with the forces of gravity. The visible indication of this is the wetting balance curve describing the wetting action when the rate of change approaches zero.
>
>润湿力与重力处于平衡状态下的润湿程度。可用变化率趋近于0时的润湿平衡曲线直观表示润湿作用大小。
>
>
>
>Eutectic Die Attach                        共晶芯片贴装             74.0454
>
>The mounting of a semiconductor die to a base material with a preform of a eutectic metal alloy that is brought to its eutectic melting temperature.
>
>采用达到共晶熔融融温度的共晶金属合金预成型焊料，将半导体芯片安装到基材上的过程。
>
>
>
>Embedded Copper (Base Materials) 埋铜（基材）          45.1718
>
>An inclusion which is composed of copper and sourced from the cladding, and may be particles from treatment transfer, broken away copper tooth, or spurious copper.
>
>源于覆层的由铜组成的夹杂物，可能是处理转移的铜颗粒、断裂的铜刺，也可能是假铜。
>
>
>
>End Mill                                             端铣刀                  51.1719
>
>A rod with straight or spiral flutes (grooves) sharpened as a cutting surface(s) and a flat or shaped end with cutting teeth, used for surface or side milling by rotary action.
>
>一种带有垂直或螺旋状凹槽的滚筒，被削尖成锋利的表面和平的或某种形状的端部，带有锋利的牙齿，通过旋转运动用作表面或侧面研磨。
>
>
>
>Entry/Backup Material                  引入/支持材料                   51.1720
>
>A material which when placed on the top (entry) and/or bottom (backup) of a stack of printed boards being drilled or routed, supports the edges of drilled holes or routed profile such that the presence of burrs is minimized.
>
>在钻孔或布板时，放置于一叠印制板的顶部（引入）和/或底部（支持），支撑钻孔边缘或切板侧面，以便将毛刺减少到最低的材料。
>
>
>
>Exposure Time (Component)    曝露时间（元器件）       30.1914
>
>The compensation factor which accounts for the time after bake that the component manufacturer requires to process the components prior to bag seal.
>
>烘烤后用于时间考量的补偿因素，元器件制造商要求在装入密封袋前处理元器件。
>
>