How to avoid copper dissolution during lead free wave soldering ? [1] Printed Circuit Board Size : 13"x16" , Thickness : 0.93" [2] Lead Free Solder Bar Type : SAC = Sn + 3 % Ag + 0.5 % Cu [3] Both sides Reflow prior to Wave Soldering [4] Wave time : 6 sec , Temperature : 265 degree C Irving Lee --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------