There are three issues with re-balling BGA's: 1. It Ramon, There are three issues with re-balling BGA's: 1. It is expensive 2. You void the component manufacturers warranty 3. It is a solder repair/replacement process that requires two heating operations(removal and Replacement) The reason we do not re-ball is because of 2 & 3. Anytime you do a repair process you can introduce reliability issues and when it is compounded by losing the warranty we decided not to reball Regards, George George M. Wenger Senior Principle FMA / Reliability Engineer Wireless network Solutions Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon Sent: Monday, November 27, 2006 8:47 AM To: [log in to unmask] Subject: Re: [TN] FW: [TN] BGA anomaly Hi George: " c). Do not re-ball Pb-Free area array packages with SnPb balls." Do you recommend not to reball SAC balls even if the solder paste to be used is SnPb and Pb profiles? Could you expand the matter? Thanks for your inputs. Regards, Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain Sent: Monday, November 27, 2006 4:57 AM To: [log in to unmask] Subject: Re: [TN] FW: [TN] BGA anomaly Many thanks all for your responses, the team have come good again! I guess I wasn't far off the mark then, looks like some discussions with the Design Team are order of the day! Regards, Iain. -----Original Message----- From: Wenger, George M. [mailto:[log in to unmask]] Sent: 24 November 2006 15:49 To: TechNet E-Mail Forum; Braddock, Iain Subject: RE: [TN] FW: [TN] BGA anomaly Iain, You've stated correctly the dilemma companies are facing. You've comment/question about option 2 creating a reliability concern and also invalidating the manufacturers warranty is also correct. Companies are going to have to make their own risk assessments. Unfortunately, many of those decisions are not knowledge based decisions because there isn't good documented information available. The recommendations I've made internally are: 1. Use SnPb assembly whenever possible 2. Use Pb-Free components and processes when product needs to be RoHS 6/6 compliant. 3. When forced into mixed alloy assembly: a. For RoHS 6/6 product, use Pb-Free processes (245-260C) when all components are compatible with Pb-Free processes. b). For RoHS 5/6 product, use maximum SnPb process temperatures (225- 235C) whenever there are components not compatible with Pb-Free processes (i.e., don't exceed the maximum temperature the MSL was tested at by the component vendor. c). Do not re-ball Pb-Free area array packages with SnPb balls. Regards, George George M. Wenger Andrew Corporation Wireless Network Solutions Senior Principal FMA / Reliability Engineer 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [Office] (732) 309-8964 [Cell] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain Sent: Friday, November 24, 2006 7:43 AM To: [log in to unmask] Subject: Re: [TN] FW: [TN] BGA anomaly This sure is an interesting dilemma! So which is the lesser of the two evils assuming you are forced into it with the Design? 1) SnPb / SAC BGA's with a temperature profile (230ish) that allows all joints to go liquidus. 2) Reball SAC BGA's with SnPb balls & use standard SnPb thermal profile. If option 2 does that not create reliability concerns also invalidate the manufacturers warranty? Regards, Iain. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier Sent: 22 November 2006 17:39 To: [log in to unmask] Subject: Re: [TN] FW: [TN] BGA anomaly *** WARNING *** This mail has originated outside your organization, either from an external partner or the Global Internet. Keep this in mind if you answer this message. Hi Ramon, Mixing SnPb with SAC is not a very good idea--you are right. 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