Denny: I got the article in an acrobat form. Yes I intended to let you know where this info came from. Copied the most relevant info of a very long interesting article based on test made using coupons that provided information about different sources of voids.. Regards, Ramon ________________________________ From: [log in to unmask] [mailto:[log in to unmask]] Sent: Wednesday, November 22, 2006 12:37 PM To: [log in to unmask]; Dehoyos, Ramon Subject: Re: [TN] Silver Plating Ramon - did you intend to post the commercial information at the start of your e-mail??? Anyway, thanks for the market information - do you mean Cookson supplied it from the three sources you listed? Denny Fritz MacDermid, Inc -----Original Message----- From: [log in to unmask] To: [log in to unmask] Sent: Wed, 22 Nov 2006 9:07 AM Subject: [TN] Silver Plating FYI Alpha STAR(r) High Performance Immersion Silver for Lead-Free Soldering Consistent reliability in a lead-free circuit board finish just reached a new level Includes Alpha STAR Results on Planar Micro void Issued / Revised: Aug 25, 2006 Surface Finishes Market Trends: Projected Global Growth and Changes in the Market: HASL 57%, OSP 20%, ENIG 14%, ImSn 3% and ImAg 6% Projected to be: HASL 37%, OSP 28%, ENIG 14%, ImSn 4% and ImAg 17% CAGR 2004 Global Finish Volume 2008 Global Finish Volume Board Sqft CAGR HASL -4.4% OSP 14.5% ImAg 42% ImSn 22% ENIG 5.7% Source: Internal, Prismark, IPC/TMRC*Immersion Silver and OSP will grow at the expense of HASL and ENIG *HASL will decline due to the non-uniform planarity, poor cleanliness, high layer count yield loss, Pb-free cost increase, lack of Pb-free process development, and industry support *ENIG high priced contact finish niche will continue, but "Black Pad"fear, assembler liability issues, and costs pressures will lead to decline*Immersion Tin growth is less clear, press fit preferred, but limited by inconsistent shelf life, long process time, tin whisker fear and solder mask compatibility --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] <mailto:LISTSERV%40IPC.ORG> with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask] <mailto:Listserv%40ipc.org> : SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask] <mailto:Listserv%40ipc.org> : SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] <mailto:sasako%40ipc.org> or 847-615-7100 ext.2815 ----------------------------------------------------- ________________________________ Check out the new AOL <http://pr.atwola.com/promoclk/1615326657x4311227241x4298082137/aol?redi r=http%3A%2F%2Fwww%2Eaol%2Ecom%2Fnewaol> . Most comprehensive set of free safety and security tools, free access to millions of high-quality videos from across the web, free AOL Mail and more. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------