This won't be just another day out of the office! Register now for IPC's upcoming workshops in January. This is your opportunity to gain insight on the latest information regarding current issues at the forefront of electronics. Lead Free Surface Finishes: The Road to RoHS Compliance Tuesday, January 16, 2007 - Phoenix, AZ 8:30 am - 11:30 am The electronics industry is moving rapidly to lead free soldering. With this movement, the industry is seeing a greater importance in solderable finishes that protect the bare copper prior to assembly. How will this impact solderability and long term reliability? Attend this workshop to find out. Learn what printed board manufacturers must do to be successful with lead free finishes. Please place and select the following link into your browser for more information: http://www.ipc.org/calendar/2007/Final_Finishes_01.16.07/FinalFinishes01 07.htm. Advanced PWB Troubleshooting: Identification, Analysis and Prevention of Critical PWB Defects Tuesday, January 16, 2007 - Phoenix, AZ 1:00 pm - 4:00 pm This intense workshop will give you the tools for advanced problem solving of printed circuit board defects. Defects such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away carry significant costs. Participants will learn how to recognize problems and take corrective action before cost is incurred. Participants should have some knowledge of the PCB fabrication process. Please place and select the following link into your browser for more information: http://www.ipc.org/calendar/2007/Final_Finishes_01.16.07/FinalFinishes01 07.htm. PCB Laminate Materials and the RoHS Change: IPC-4101 Specification, Bromine Free and Reliability Wednesday, January 17, 2007 - Phoenix, AZ This new workshop will explain how the market challenges faced in CCL and how the industry specifications are being changed to face these challenges. The European legislation will be discussed, as will the latest specification sheet proposals for IPC-4101 "Specifications for Base Materials for Rigid and Multilayer Printed Boards." The impact will be on laminate resin systems will be identified and the potential reliability impact discussed. Options for determining how to call out laminates will be detailed. In addition, curing agent change and opportunities to improve resin systems will be analyzed. Please place and select the following link into your browser for more information: http://www.ipc.org/calendar/2007/PCB_Laminate_Materials_0107/PCBLaminate Materials0107.htm Advanced Packaging Technologies and Future Trends Workshop (Full Day) Thursday, January 18, 2007 - Phoenix, AZ As the first interconnection element after the semiconductor chip itself, IC packaging technologies are the primary gate keepers of electronic system performance. There are a myriad of different types of packages available, each normally targeted for a specific range of semiconductor devices. With so many options, understanding the basics of IC packaging - how they are constructed, what drives cost and what limits performance - is critical to the successful product design. Please place and select the following link into your browser for more information: http://www.ipc.org/calendar/2007/Advanced_Packaging_01.18.07/AdvancedPac kaging0107.htm --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------