Guys, need some help. We've got a dispute about how lead spacing is dimensioned according to the JEDEC specs. I had a class in Y14.5 a long while ago, and my geometric dimensioning and tolerancing is pretty rusty. This is of more than theoretical interest, because we're trying to decide when to perform hot solder dip on pure tin components. Here are some links to the specs for some 25 mil pitch parts, on the JEDEC website: http://www.jedec.org/download/search/MO-137C.pdf http://www.jedec.org/download/search/MO-118b.pdf What are the max and min lead spacings? Yes, the lead can change width, being wider at the top of the package, but I'm more interested in how to figure this out for a whole family of leaded parts. -Joe --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------