Not sure I worded this question so will ask again a slightly different way as I didn't get any responses.

If one is reflow soldering ENIG boards with a mixture of SnPb & PbF part (in particular PbF BGA's - SAC305) using a 63/37 SnPb solder what would be the preferred peak temp / time above?

Regards,
	Iain.

-----Original Message-----
From: Braddock, Iain 
Sent: 17 November 2006 08:35
To: [log in to unmask]
Subject: RE: [TN] BGA anomaly


Joyce,

I can't say it is preferable but how does one solder a board using SnPb solder with the odd PbF part whilst trying to ensure the profile will provide sufficient time above Solidus (Werner see I've learned!) to enable a satisfactory soldered joint?

Regards,

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