This question to the group is about expected solder joint strength on a BGA. The BGA in question is a 8 x 8mm plastic package BGA using a LF SAC305 soldering process. It has 64 x 0.018" balls holding it to the PCB. When removing this device for rework 3-4% of the time one of the corner NO CONNECT pads comes off. The question is if we do nothing upon replacement of a new device to the damaged pad will it really make a difference ??? We are arguing that the holding strength of the reworked device would be approximately the same because the change in overall surface area is marginally impacted. Thanks Bob Wettermann Bob Wettermann --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- PH 847-767-5745