if it is PTH, my book is <8 u-inch... IPC is remove 95% of 2.5 micron, that make 5 u-inch... suit me just fine...jk abcd -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Kane, Amol (349) Sent: Friday, November 03, 2006 9:46 AM To: [log in to unmask] Subject: Re: [TN] Gold Embrittlement Hi Werner and other fellow Technetters, The gold plating in question is not on the pads on the board, but on the leads of a TH component.The J-STD-001 says that gold should be removed from the component only when it is greater than 2.5 micrometers (approx. 0.09 mils) thick, while the part in question has 10 microinches of gold on it (0.01 mils). As Joyce pointed out, 2.5 micrometers comes to 100 microinches (0.1 mils). I do not know what process was used by the vendor to coat the leads ( I can find out), but the core question still remains, what is the max thickness that is critical for Au embrittlement. As per J-STD-001, it is 100 microinches! (unless the J-STD-001 is talking about removing the gold for a different reason) Makes sense? Amol -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE) Sent: Friday, November 03, 2006 8:49 AM To: [log in to unmask] Subject: Re: [TN] Gold Embrittlement Werner, Excellent points, especially about uniform distribution. I argue quite often with people on that issue. I think the last word was a Freudian slip. With the information given you were "tipping your Hand", but I think you meant to say dipping. Unless, of course, you meant by tipping that the parts would come in with the correct final finish and thus negate the need to dip. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier Sent: Thursday, November 02, 2006 3:06 PM To: [log in to unmask] Subject: Re: [TN] Gold Embrittlement Hi Amol, I you have imersion Au, Au-embrittlement is not a problem because there is not enough Au. Be careful, however, if your PCBs come from China; I have seen much thicker Au-layers than are possible with iAu. Calculating the wt% of Au in a soldert joint is an exercise in futility, because you have to make the assumption--frequently not warranted--that the SnAu-IMCs are uniformally distributed. In cases where you suspect thicker Au [and for the matter Ag; which is equally as bad as Au in causing SJ-embrittlement] deposits, the safest course of action is to wash the Au (Ag) off by tipping. 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