IMHO the analysis of copper more than standard SAC may be caused by the
cross section preparation, smearing, etc.
Head in pillow it is and check the following:
http://alphametals.com/products/solder_solutions/pdf/pillowhead.pdf
Gaby

----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, November 15, 2006 11:20 PM
Subject: Re: [TN] Separation in BGA joints


> Hi Vladimir,
> Certainly, more solder paste would have helped; but IMHO is is still the
> temperature being too low.
>
>
>
> Werner
>
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