Assuming you're not assembling at sea -- the finish will have disappeared into your solder joint long before your ship sails. Question is do you prefer a copper/solder or a nickel/solder bond. Ian -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Charlie McMahon Sent: Friday, October 20, 2006 7:28 AM To: [log in to unmask] Subject: Re: [TN] Gold immersion vs. silver immersion Good Morning All: Might I ask for some guidance from you all.. In determining a surface coating a conflict has arisen between choosing Gold immersion vs. Silver immersion as the choice. The application is for boards that are used in shipboard electronics (non military) but they are protected from the external environment. My question is which is the more appropriate coating? Technically, the gold has always worked from the PCB fab and assembly end with success with a controlled cost of ownership. The silver however is one that causes concern. Any suggestions would be appreciated. Best Regards, Charlie McMahon McMahon Sales Company --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------