Hi amigos, I should never said that we had no ENIG problems. Now we seem to have one. Chinese board supplier. Problems with heavy wire aluminum bonding on the ENIG pads. Too low pull test values. Possible reason: pad surface invaded by copper particles after the bake/reflow/mounting. Sending picture to Mr Yoda. Never seen this before. Gold is too thick for being ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the surface so rapidly and at those low temperatures which are typical for a general assembly process. Any clue? Graham? You seem to be sitting at the keyboard just now. Ingemar Hernefjord SAAB MICROWAVE SYSTEMS --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------