(Steve, will examine your mystery picture later.) Yes, pull values insufficient. As low as 25 grams. The presented area is a non bonded area, in fact the ENIG looks this way nearly all over the board. Some pads are OK, others worse than the one on the wall. 127um, undoped wire. No, don't think those objects are intermetallics. The pulled area looks quite normal, that's what twists my brain. I'll fix SEM images on that too for you. No, nothing changed in the process. We have made about 2 million boards in this line before this ocurred. Could be a thin contamination, because the 'blackish' objects you see on the SEM image are only visible at EHT 1-5 kV. Thanks for your engagement, even if it's not a Friday question, but real disaster. Inge ----- Original Message ----- From: "Creswick, Steven" <[log in to unmask]> To: <[log in to unmask]> Sent: Tuesday, October 17, 2006 4:49 PM Subject: Re: [TN] ENIG problem Ingemar, Wow! Can't bond with heavy aluminum? Stuff must be really bad! Actually, it appears as though you are able to bond, just don't like the pull values - correct? Is the area depicted a region which was bonded? Are you using 127µm or 254µm wire? If the image depicts an area that was bonded, it certainly does not appear to show evidence of adhesion. Are the areas that Yoda speaks of regions of intermetallic formation, or something else? What does the pulled bond [residual on the board] look like? We assume that part clamping has not changed, etc. Just imagine how much fun someone would have with 25µm wire!!!! Thin coating of flux or organics on the board?? Steve - not Yoda -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord (KC/EMW) Sent: Tuesday, October 17, 2006 10:05 AM To: [log in to unmask] Subject: [TN] ENIG problem Hi amigos, I should never said that we had no ENIG problems. Now we seem to have one. Chinese board supplier. Problems with heavy wire aluminum bonding on the ENIG pads. Too low pull test values. Possible reason: pad surface invaded by copper particles after the bake/reflow/mounting. Sending picture to Mr Yoda. Never seen this before. Gold is too thick for being ENIG (>1um), Nickel about 6um. Can't see how Copper could diffuse to the surface so rapidly and at those low temperatures which are typical for a general assembly process. Any clue? Graham? You seem to be sitting at the keyboard just now. Ingemar Hernefjord SAAB MICROWAVE SYSTEMS THE INFORMATION CONTAINED IN THIS E-MAIL MESSAGE AND ANY ATTACHMENTS SENT FROM GENTEX CORPORATION IS GENTEX CONFIDENTIAL INFORMATION INTENDED ONLY FOR THE PERSONAL USE OF THE INDIVIDUAL OR ENTITY NAMED ABOVE. If you are not the intended recipient, you are hereby notified that any review, distribution, or copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by return e-mail, and delete this e-mail message and any attachments from your computer. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------