Jim- The depressing aspect of your problem is the word "reel". There is no way to effectively bake them out while still on the reel without taking literally months. There are reel service houses who will de-reel, bake, and re-reel for you. Last I checked that is about $100 for each reel. Also, bakeout may reduce solderability due to oxide growth unless its done inertly. The old test to see if a package needed to be baked out was to grab a handful of them and toss them into a solder pot (while wearing appropriate personal protective equipment, of course!). This test was called the "popcorn" test, and was appropriate for wave soldered SMT. If some of the packages "popped", then they need bakeout. Pretty crude, but it was actually used for awhile. More scientifically, you could try and find a "maximum moisture level" for the package and then measure the moisture level by baking some parts and compare weights before and after. The accuracy of your scale will determine how many parts you will need to bake to get a sufficiently accurate wt% moisture. Wayne Thayer >>> [log in to unmask] 10/11/2006 8:21 am >>> Jim, Per J-STD-033 and J-STD-020, the package of components must be clearly marked with the component's MSD level, and should be handled as such. Tell the chip manufacturer to get with the program. And bake the parts. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan Sent: Wednesday, October 11, 2006 7:17 AM To: [log in to unmask] Subject: Re: [TN] Are TSSOP-8 packages moisture sensitive Jim, all plastic packages are MSDs. You have to contact the manufacturer to have the specifics, or, if you are lucky you are going to see the MSD level on the bags when you get the part. Good luck, Ioan -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of West, Jim Sent: Tuesday, October 10, 2006 4:24 PM To: [log in to unmask] Subject: [TN] Are TSSOP-8 packages moisture sensitive Are TSSOP-8 packages susceptible to moisture? We have a chip manufacture offering a reel of a TSSOP component that has been on their shelf since late '04'. The component is a N-Channel MOSFET. By the time we receive them, it will be late this year, should I bake them when we get ready to use to be safe? Thanks, Jim West Engineering Manager Nexergy Inc. www.nexergy.com tel: (614) 351-6216 fax: (614) 324-1979 This email message and all attachments transmitted with it are intended solely for the use of the addressee(s) and may contain legally privileged, protected or confidential information. 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