Question on IPC-A-610D, open for interpretation I guess... Per Section 10.5.1.1: Cracking of Solder Resisit = Defect, Class 3 Per Section 10.5.1.2: Blisters / flaking exposes bare copper = Process Indicator, Class 3 Huh???? So if I have cracks in the solder mask (but still adhered) over the PCB laminate (not between conductors or over conductors), it's scrap, but if I have soldermask which is completely gone and exposes copper of a trace or pad, it is a "Process Indicator"? Opinions? Thanks, Kevin Glidden Manufacturing Engineer Astronics Luminescent Systems Inc. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------