Question on IPC-A-610D, open for interpretation I guess...

Per Section 10.5.1.1: Cracking of Solder Resisit = Defect, Class 3

Per Section 10.5.1.2: Blisters / flaking exposes bare copper = Process
Indicator, Class 3

Huh????

So if I have cracks in the solder mask (but still adhered) over the PCB
laminate (not between conductors or over conductors), it's scrap, but if I
have soldermask which is completely gone and exposes copper of a trace or
pad, it is a "Process Indicator"?

Opinions?

Thanks,
Kevin Glidden
Manufacturing Engineer
Astronics Luminescent Systems Inc.

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