I suppose that if the lead coating was gold over palladium this same source would make a similar recommendation consistent with the melting points of these elements. Best regards Lee J. Lee Parker, Ph.D. JLP Consultants LLC 804 779 3389 ----- Original Message ----- From: "Richard Kraszewski" <[log in to unmask]> To: <[log in to unmask]> Sent: Thursday, October 26, 2006 1:17 AM Subject: [TN] Backward Compatibility of Tin Electroplating Does anyone have any reason to suspect that tin electroplated SM components being soldered with a 63/37 solder paste require a profile that must exceed the reflow temperature of tin? Being told by a component vendor this is the case. I would totally discount this but seem to recall reading this more than once on some other component Tech data sheets. I can't explain why this would be necessary, but..... Any thoughts would be appreciated. Rich K / Kimball --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------