Ingemar, One thing attracted my attention when I read your posting. You stated that the gold was very thick (>1um) As a supplier of ENIG Chemicals and the chairman of the plating committee that specified ENIG as surface finish, I can tell you that the process is not capable of depositing that thickness of gold on nickel. The only time this gold thickness may be encountered is when the nickel plating skips the pad (does not or fails to plate) and the gold is deposited directly on a copper pad. Verify the Ni thickness on that specific pad that had the very high gold deposit thickness. this may give us a clue as to what is behind the failure. Regards George Milad George Milad National Accounts Manager for Technology Uyemura International Corp (UIC) 249 Town Line Rd Southington CT 06489 [log in to unmask] Cell: (516) 901 3874 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------