Anil, except foro IPC and other standards, the used bonding technology and wire dimension plays a role. 0.8 micrometer is a very smooth and fine pad, but we don't have such a tough requirement if it ain't necessary. So, bonding ball and gold 17um is equal to 0.5 micrometer, while bonding ball and gold 50 um has 1.5 um. If we are bonding on nickel plated pads using 250um aluminium wedge, the pads can look like anything. So, it's a whole range of values depending on metal finish, metal finish thickness, wire material, substrate properties etc. That's the practical side, which does not always coincide with standards. Let me finish by adding that far more important than roughness value is CLEANLINESS! And pad finish hardness vs. the wire. Best way to check is, of course, wire pull test. Harman's book is excellent for all working with wire bonding. Get that, Anil. Worth its weight in gold! (no,no...not IAu) Inge Dear all wire bond experts Is 0.8 micron RMS roughness value achievable on wire bond pad area? as per IPC 6012B - 3.5.4.3. Do users regularly sample lots under 1000X or an SEM? How do you judge it ? What is normally acceptable at low end bonding of 10 to 50 wbps? thanks Anil micro interconnexion pvt. ltd D3-12A, Corlim Industrial Estate Corlim, Ilhas , Goa , India 403110 tel: 91-832-2284209/337. fax 2284209/2285271 e mail: HYPERLINK "mailto:[log in to unmask]"[log in to unmask] Leaders in Gold plated PCBs - selective/ cob an ISO 9001-2000 Company -- No virus found in this outgoing message. Checked by AVG Free Edition. Version: 7.1.405 / Virus Database: 268.12.5/451 - Release Date: 9/19/2006 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------