Dear Technets, Is there a standard that defines a minimum pull force requirement after the component has been soldered. The issue is, to get a better joint we had introduced extra solder to the component(confirms to IPC-610D). The component in question is a SMT type lug which is hand soldered. The customer tells that excess solder on the lugs would cause the pad peel off in the field. Do we have a minimum pull force value which can be adopted so that we can give assurance to customer that there will be no issue with joints. Advance thanks for the help. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------